10/09/2020

Transistor-integrated cooling - Advanced NVMe controller

Usually, electronic technologies, designed by electrical engineers, and cooling systems, designed by mechanical engineers, are done independently and separately. But now, EPFL researchers have quietly revolutionized the process by combining these two design steps into one: They've developed an integrated microfluidic cooling technology together with the electronics that can efficiently manage the large heat fluxes generated by transistors. Their research, which has been published in Nature, will lead to even more compact electronic devices and enable the integration of power converters, with several high-voltage devices, into a single chip.

"We placed microfluidic channels very close to the transistor's hot spots, with a straightforward and integrated fabrication process, so that we could extract the heat in exactly the right place and prevent it from spreading throughout the device.

Read More: https://techxplore.com/news/2020-09-transistor-integrated-cooling-powerful-chip.html

KAIST researchers have advanced non-volatile memory express (NVMe) controller technology for next generation information storage devices, and made this new technology, named 'OpenExpress', freely available to all universities and research institutes around the world to help reduce the research cost in related fields. In a test comparing various storage server loads on devices, the team's FPGA showed 76% higher bandwidth and 68% lower input/output delay compared to Intel's new high performance SSD (Optane SSD), which is sufficient for many researchers studying systems employing future memory devices. Depending on user needs, silicon devices can be synthesized as well, which is expected to further enhance performance.

Read More: https://techxplore.com/news/2020-09-advanced-nvme-technology-memory-devices.html

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